/ 뉴스 /

Overview of recent direct wafer bonding advances and applications

뉴스

Overview of recent direct wafer bonding advances and applications

2019-09-18

Direct wafer bonding processes are being increasingly used to achieve innovative stacking structures. Many of them have already been implemented in industrial applications. This article looks at direct bonding mechanisms, processes developed recently and trends. Homogeneous and heterogeneous bonded structures have been successfully achieved with various materials. Active, insulating or conductive materials have been widely investigated. This article gives an overview of Si and SiO2 direct wafer bonding processes and mechanisms, silicon-on-insulator type bonding, diverse material stacking and the transfer of devices. Direct bonding clearly enables the emergence and development of new applications, such as for microelectronics, microtechnologies, sensors, MEMs, optical devices, biotechnologies and 3D integration.



Source:IOPscience

For more information, please visit our website: www.semiconductorwafers.net,

send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com










문의하기

우리 제품에 대한 견적이나 더 많은 정보를 원하신다면, 우리에게 메시지를 남겨 주시고되도록 빨리 회신 해주십시오.